Huawei has announced that the company plans to launch new AI chips, the 960DT and Ascend 960PR, in the first and third quarters of 2027, respectively. This plan is designed to strengthen the company's competitiveness in the AI chip market and enhance the computational capabilities of larger systems.
Development of UnifiedBus Technology
Wang stated at a corporate event in Shanghai that Huawei's UnifiedBus technology is considered a key link in the next generation of the company's large AI systems. This technology allows chips to share information and collaborate more effectively. According to Wang, Huawei has developed 11 types of semiconductors based on UnifiedBus technology for use in its large systems.
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The company's larger systems, known as superclusters, can support up to 1 million AI processors. Additionally, Huawei has shipped over 1,000 smaller systems called supernodes to more than 370 customers. Supernodes are systems that gather several AI chips to perform a specific task.
Competition in the Global AI Chip Market
The competition between the United States and China for the development of chips, data centers, and related AI software is intensifying. The United States has imposed export restrictions that limit China's access to certain advanced chips and semiconductor manufacturing equipment. In contrast, Chinese companies and policymakers are placing greater emphasis on building domestic alternatives.
This situation has increased the importance of inter-chip connectivity for Chinese tech companies. U.S. export restrictions have helped Huawei emerge as one of the prominent suppliers of AI chips in China. However, the company faces competition from its powerful rival, Nvidia, whose hardware and software tools are widely used by developers around the world.
A strong developer base is crucial for Huawei's efforts to make its hardware easier to use. Wang announced that Huawei's AI chip ecosystem has 5,270 active developers monthly.
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